A microchannel heat exchanger is a heat exchanger with a channel diameter of 10-1000 m. The flat tube of this heat exchanger has ten small flow channels, which are connected with the round header at both ends of the flat tube. Baffles are arranged in the manifold to separate the flow passage of the heat exchanger into several flows. The microchannel heat exchanger of Dongtao is made of copper, silicon, Si3N4 and other materials. Using copper material, the metal plate can be processed into a small and smooth fluid channel, and the finned size and thickness of the plate can be precisely controlled, up to dozens of microns. After brazing, the plate cross-flow structure is formed, and the heat transfer coefficient can reach 45MW/(m3·K), which is 20 times of the traditional compact heat exchanger. The multi-layer structure with more complex structure can be manufactured by using silicon, Si3N4 and other materials. New heat exchangers can be processed through the anisotropic etching process. Various structures and sizes can be manufactured by using sandwich and stacking technology, such as the heat exchangers with angular cone structure. The field of microelectronics follows the rapid development of Moore's Law. With the continuous improvement of transistor integration, the thermal density of high-speed electronic devices has reached 5~10MW/m2, and heat dissipation has become the main bottleneck of its development. It has become an inevitable trend for micro-channel heat exchanger to replace the traditional heat exchange device. Therefore, micro-channel heat exchangers will have a broad application prospect in many fields such as aerospace, modern medical, chemical and biological engineering, where embedded technology and high-performance computing are highly dependent.